Qualcomm Snapdragon 820 specs leak, features “significant” thermal improvements over the 810

Details on Qualcomm’s next flagship mobile chip just made their way online.

The leak comes courtesy of a Chinese analyst who posted Qualcomm’s internal documentation on the chip to the country’s popular Weibo social network.

According to one of the slides, the 820’s processor is 35 per cent faster than its predecessor. Likewise, GPU performance is 40 per cent improved over the 810.

Perhaps more importantly, the Snapdragon 820 features “significant” power and thermal improvements thanks to a new 14nm manufacturing process. Given that the 810 quickly gained a reputation for overheating, this is probably the most important news regarding Qualcomm’s newest system on a chip. Otherwise, it’s a fairly iterative upgrade for the chip manufacturer.

Qualcomm is expected to launch the Snapdragon 820 later this month.

[source]Weibo[/source][via]Engadget[/via]